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Module: HBV-1466WA S1.0
Module Size: 68.2 mm × 26 mm × 12.5 mm
Temperature (operation): - 20 ° C to 70 ° c
Temperature (Stable Image): 0 ° C to 50 ° C
Assembly technique: SMT (ROSH)
Distance from the object: 30 CM-200 CM
Resolution: 600LW / PH (Center)
PCB printing ink: black
Interface: USB 2.0
Power consumption: 150 mW (VGA); 200 mW (QSXGA);
Operating System Request: Windows 2000 Windows XP Windows 7
Certifications: FCC and CE
Sensor Type: OV5640 (1/4 ")
Active height of painting: 2592 x 1944
Sensitivity: To be determined
Pixel size: 1.4 and micro; m x1.4 and micro; m
Maximum image transfer rate: 15 fps for QSXGA
S / N ratio: to be determined
Dynamic range: To be determined
Package: CSP, bare matrix
Lens construction: 4G + IR
F / No: 2.4
BFL (optical): 2.5mm
DFOV: 120 °
Relative lighting (sensor): 70%
IR filter: 650 ± 10nm
AGC / AEC / white balance: Auto
Output formats: USB suspend
Fixed pattern noise: <0.03% of VPEAK-TO-PEAK
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